Shanghai Plaster Workshop

Course Format:

Hands-on Workshop

Conducted as part of NUS Graduate Programmes in Architectural Conservation

Cost:

S$1,250 (Inclusive of 8% GST)

Description:

This two-day executive programme is aimed at professionals in the conservation/heritage sector who want to gain practical experience with Shanghai Plaster. Shanghai Plaster is a type of granolithic cement plaster which was popularised through its use in modern buildings in the 1930s. This course is suitable for those with no prior experience.

The course will cover the following:

● A brief history of Shanghai Plaster

● Selecting products and specifications

● Material sourcing and types of aggregate used in Shanghai Plaster

● Understanding the processes behind cleaning and restoring a Shanghai Plaster facade

● Hands-on experiences and demonstrations with Shanghai Plaster

The course sessions will be delivered at the newly established Architectural Conservation Laboratory (ArClab). ArClab is a conserved historic shophouse now serving as a living laboratory under the Department of Architecture, NUS. It focuses on holistic research and training related to building survey processes, in-depth analysis, and critical assessment of building materials and systems to advance in digital conservation technology, material sciences, and building aesthetics.

The course will be conducted by esteemed personnel with long-standing experience in studying and understanding Shanghai Plaster. They are Dr Dai Shibing (Director of Architecture Conservation Laboratory, College of Architecture and Urban Planning, Tongji University), Mr Kojio Ryusuke (Takenaka Corporation), Mr Jackson Lee (Bautec), and Dr Nikhil Joshi (SPAB Scholar & Architectural Conservation Laboratory, Department of Architecture, National University of Singapore).

Participants will be advised to wear suitable clothing and sturdy footwear. PPE (goggles, gloves) and all tools and materials will be provided. Participants are welcome to bring their own goggles and gloves if they wish.